Machine: GALAXY, SPEEDFAM
1. Leading technology
2. Good self-sharpening
3. No dressing required
4. High yeild rate of work-piece
E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology make it possible to grind all types of wafer with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding, or resin bond for fine finishing improved process accuracy. Our back- grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Used for wafer’s back thinning in LED and Semiconductor industries.
Material: Sapphire, Silicon
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