- Resin Bond Grinding Wheels
- Vitrified Bond Grinding Wheels
- Metal Bond Grinding Wheels
- Electroplated Tools
- Dicing Blade & Grinding Wheels For Semi-Conductor
- Grinding Wheel Dressing Tool
Henan E-Grind Abrasives Co., Ltd can offer the semiconductor industry cutting-edge dicing blades & grinding wheels of the utmost quality. Diamond tools play a significant part in the production of semiconductors from a wafer to a single chip.
We can provide all kinds of dicing blades and grinding wheels for the semiconductor industry, both dicing blades without hubs and dicing blades with hubs for cutting and making grooves, and diamond grinding wheels for back-thinning wafers.