Efficient Grinding Solution
Efficient Grinding Solution
E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back-grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
