PRODUCTS

Dicing Blades With Hub

Product Details:

Product Specification

Available shape:

Performance

Our diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keep the edge not to be broken, so the cutting with the blade is in high efficiency and excellent quality.

Description

Our diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keep the edge not to be broken, so the cutting with the blade is in high efficiency and excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, gaas, gap, pzt etc.

Working Condition

Wet

Application

This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt etc.

MESSAGE

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